Our users can now directly measure the through-plane Thermal Effusivity of bulk and layered samples with high accuracy using our Hot Disk® or Hot Strip® sensors. This module is tailored to test low thermally conducting soft/flexible materials, such as textiles, fabrics, and cushioning. It is also useful for testing higher thermally conductive samples such as thermal interface materials.
The Effusivity Module complements our existing measurement modules, which are designed to meet the specific needs of various sample geometries, thermal conductivity ranges, and material types. Whether you’re working with bulk, anisotropic, slab, or thin film samples, our add-on modules help you push the boundaries of thermal analysis.
The Thermal Effusivity Measurement Module meets ISO standard 22007-7. Hot Disk AB has contributed to the development of this standard, and the theory behind originates from our paper published in Review Scientific Instruments in 2003.